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As a form-in-place gasket/sealant
the highest retention strength
Medium curing speed
leading to incomplete curing and bonding failure
Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure As a form-in-place gasket/sealantAdhesive epoxy gel for bonding surface mount components to printed circuit boards prior to wave soldering LOCTITE 3609 is a dark red tacky epoxy gel suitable for bonding surface mount components to printed circuit boards prior to wave soldering. It is particularly suitable for applications requiring medium to high dispensing speeds, high precision dispensing specifications, high wet strength and good electrical properties.
US$ 14.99
US$ 36.00
US$ 198.00
